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The Galaxy S27’s chip could be much cooler thanks to this fundamental change

The Galaxy S27’s chip could be much cooler thanks to this fundamental change

Posted on April 29, 2026October 10, 2026 By Muhammad Safdar No Comments on The Galaxy S27’s chip could be much cooler thanks to this fundamental change
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Everything you need to know about the galaxy s27 chip could.

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C. Scott Brown / Android Authority

TL;DR

  • The Samsung Exynos 2700 processor will feature the processor sitting side-by-side with the DRAM.
  • This should enable improved thermal performance, which should lead to better sustained performance and cooler temperatures.
  • This follows the Exynos 2600’s use of a Heat Path Block to reduce heating.

The Samsung Exynos 2600 processor powers the Galaxy S26 and S26 Plus in some markets. However, the company is undoubtedly working on the Exynos 2700 with a view to using it on the Galaxy S27 series. Now, it looks like we’ve got the first details about the new chipset.

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We can confirm that the Samsung Exynos 2700 will have the processor and DRAM sitting side-by-side on the same substrate. This would be a significant change from previous Exynos chips, which have the DRAM placed on top of the processor’s substrate.

So what’s the reason for this change, then? We understand that this approach should deliver improved thermal performance. That’s good news, especially in light of leaks that Arm’s next Ultra CPU core could offer a maximum clock speed of almost 5GHz. This next-generation CPU core is also expected to be used in the Exynos 2700.

Samsung Exynos 2600 with HPB

This news comes after Samsung added a so-called Heat Path Block (HPB) to the Exynos 2600. The HPB is effectively a heat sink, and it previously sat next to the DRAM but atop the chipset (see the image above). So we’re guessing that the HPB might now cover both the DRAM and the processor itself due to the Exynos 2700’s new side-by-side approach.

In any event, we’re glad to see Samsung taking these steps to improve thermal performance. If the combo of HPB and a side-by-side approach bears fruit, we could see great sustained performance and reduced device temperatures. This would be good news for demanding workloads, like heavyweight games or APV video capture.

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More on the galaxy s27 chip could

Stay tuned for updates on the galaxy s27 chip could as the story develops. Related: Is Samsung going to be using the same camera again with the Galaxy S27?.

Frequently Asked Questions

What is the big design change in the Exynos 2700?

The Exynos 2700 will have the processor and DRAM sitting side-by-side on the same substrate, unlike previous Exynos chips that placed the DRAM on top of the processor's substrate.

Why does the side-by-side layout matter?

The approach should deliver improved thermal performance, leading to better sustained performance and cooler temperatures, which helps demanding workloads like heavyweight games or APV video capture.

How did the Exynos 2600 handle cooling?

The Exynos 2600 added a so-called Heat Path Block (HPB), effectively a heat sink that sat next to the DRAM but atop the chipset.

What clock speed could Arm's next Ultra CPU core reach?

Leaks suggest Arm's next Ultra CPU core, expected to be used in the Exynos 2700, could offer a maximum clock speed of almost 5GHz.

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Tags: News Samsung Samsung Exynos Samsung Galaxy S27

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